JPH01145114A - プリント回路基板の射出成形方法 - Google Patents

プリント回路基板の射出成形方法

Info

Publication number
JPH01145114A
JPH01145114A JP30357987A JP30357987A JPH01145114A JP H01145114 A JPH01145114 A JP H01145114A JP 30357987 A JP30357987 A JP 30357987A JP 30357987 A JP30357987 A JP 30357987A JP H01145114 A JPH01145114 A JP H01145114A
Authority
JP
Japan
Prior art keywords
circuit
pattern
cavity
board
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30357987A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0520257B2 (en]
Inventor
Kazumitsu Omori
大森　和光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiki Seisakusho KK
Original Assignee
Meiki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho KK filed Critical Meiki Seisakusho KK
Priority to JP30357987A priority Critical patent/JPH01145114A/ja
Publication of JPH01145114A publication Critical patent/JPH01145114A/ja
Publication of JPH0520257B2 publication Critical patent/JPH0520257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP30357987A 1987-11-30 1987-11-30 プリント回路基板の射出成形方法 Granted JPH01145114A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30357987A JPH01145114A (ja) 1987-11-30 1987-11-30 プリント回路基板の射出成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30357987A JPH01145114A (ja) 1987-11-30 1987-11-30 プリント回路基板の射出成形方法

Publications (2)

Publication Number Publication Date
JPH01145114A true JPH01145114A (ja) 1989-06-07
JPH0520257B2 JPH0520257B2 (en]) 1993-03-19

Family

ID=17922701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30357987A Granted JPH01145114A (ja) 1987-11-30 1987-11-30 プリント回路基板の射出成形方法

Country Status (1)

Country Link
JP (1) JPH01145114A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3991179T1 (de) * 1989-09-26 1990-10-11 Rogers Corp Gekruemmter plastikkoerper mit schaltungsmuster, und herstellungsverfahren dafuer
JPH04125117A (ja) * 1990-09-14 1992-04-24 Meiki Co Ltd プリント回路基板およびその射出成形装置
FR2668959A1 (fr) * 1990-11-08 1992-05-15 Merlin Gerin Procede et dispositif pour le depot d'une couche de peinture reactive au laser sur une piece moulee.
JP2011119611A (ja) * 2009-12-07 2011-06-16 Furukawa Electric Co Ltd:The 射出成形基板及び射出成形部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62237793A (ja) * 1986-04-08 1987-10-17 日本写真印刷株式会社 印刷配線板の製造法
JPS6381896A (ja) * 1986-09-26 1988-04-12 古河電気工業株式会社 転写回路付き成形体の製造方法
JPS63257293A (ja) * 1987-04-14 1988-10-25 大日本印刷株式会社 印刷回路を有する成形品の製造方法およびその製造に使用する転写シ−ト

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62237793A (ja) * 1986-04-08 1987-10-17 日本写真印刷株式会社 印刷配線板の製造法
JPS6381896A (ja) * 1986-09-26 1988-04-12 古河電気工業株式会社 転写回路付き成形体の製造方法
JPS63257293A (ja) * 1987-04-14 1988-10-25 大日本印刷株式会社 印刷回路を有する成形品の製造方法およびその製造に使用する転写シ−ト

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3991179T1 (de) * 1989-09-26 1990-10-11 Rogers Corp Gekruemmter plastikkoerper mit schaltungsmuster, und herstellungsverfahren dafuer
JPH04125117A (ja) * 1990-09-14 1992-04-24 Meiki Co Ltd プリント回路基板およびその射出成形装置
FR2668959A1 (fr) * 1990-11-08 1992-05-15 Merlin Gerin Procede et dispositif pour le depot d'une couche de peinture reactive au laser sur une piece moulee.
JP2011119611A (ja) * 2009-12-07 2011-06-16 Furukawa Electric Co Ltd:The 射出成形基板及び射出成形部品

Also Published As

Publication number Publication date
JPH0520257B2 (en]) 1993-03-19

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